altrus

Slackware was my first linux distribution, and one that I used continuously before moving to Arch.

As it happens, I think Arch embodies many of the original Slackware principles, but its focus on more modern hardware led to it growing a larger community - one that includes great documentation.

TLDR; If you're looking to reduce the risk of contamination, consider purchasing whole chickens or, at least, skin-on, bone-in, cuts.

This is because the risk is substantially higher if you purchase skinless or deboned chicken - most contamination is on the surface of the chicken, and is easily killed during cooking.

However, during processing, the tooling used to debone or deskin the chicken may get contaminated, and necessarily pierces the flesh of the meat. This tooling isn't usually disinfected between chickens (cost prohibitive). As a result, if one of the birds has surface contamination, this contamination will remain on the outside of the instrument, grow, and subsequently infect the inside of all the other birds.

This is important, because direct heat is actually pretty good at killing bacteria. However, if the bacteria are able to penetrate to the inside of the chicken, there's a substantially greater likelihood that the temperature (and duration) on the inside of the chicken are insufficient to kill disease causing bacteria.

Note: The overall idea is to recognize that surface bacterial contamination can be killed with sufficient temperature over a sufficient duration of time, recognizing that the lowest overall temperature will be in the thickest part of the meat, and ensuring that there isn't a mechanical mechanism that will introduce contamination in that area.

That is stack up dependant - we work the board house on that, depending on geometery and material. Once they give us a ballpark, we will adjust our widths and clearances to something reasonable, recognizing that fab will adjust the traces and arcs to whatever spec we subsequently need.

We use kicad for the design of a 28 layer PCB that includes a number of high speed (>10Gbps) impedance controlled lanes, including 25Gbps signal lines, and implementing three DDR4 banks, with a varying number of discrete chips, and breaking out from a large pin BGA, using a number of HDI features (blind/buried vias, etc).

We've been closely tracking the releases, and, at this point, our layout tech prefers using Kicad over another (proprietary) tool for the majority of layouts - so much so that's she's pushing for us to port all our designs to it.

I don't entirely understand this; could you provide a concrete example, or actual trades, that could be involved in such a position? (I'm just curious how it would actually look like in practice.)