Since these ceramic decoupling capacitors can be made so small nowadays and since very low-inductance capacitors are suited to handle today's high frequency switching noise, maybe it is worth the cost for IC packages should incorporate a small sized (low inductance) capacitor directly in the package, as that would be much closer to the silicon's power & ground than could be placed on a pcb. Then the pcb would only need to have the larger (>=1uF) capacitor.
Just after I typed the above, I see Intel has such a patent filed in 2001 (https://patents.google.com/patent/US20050156280A1/en). So maybe that patent has prevented other companies from adopting such a practice. (Having decoupling capacitors already in the package would sure make hobbyist pcb designing much easier, cause it is so hard to deal with tiny SMD parts.)
Just after I typed the above, I see Intel has such a patent filed in 2001 (https://patents.google.com/patent/US20050156280A1/en). So maybe that patent has prevented other companies from adopting such a practice. (Having decoupling capacitors already in the package would sure make hobbyist pcb designing much easier, cause it is so hard to deal with tiny SMD parts.)