Mechanical integrity in industrial processes is often divided into two categories: static equipment (tanks, pipes, heat exchangers...) and rotating equipment.
These two have very distinct failure modes. The failure mechanisms for solid state electronics are much more similar to those for static equipment (corrosion, thermal fatigue, creep, ...)
These two have very distinct failure modes. The failure mechanisms for solid state electronics are much more similar to those for static equipment (corrosion, thermal fatigue, creep, ...)