It’s still dedicated ram on a separate chip, which is affected by supply shortages.
The ram is soldered onto the SoC in close proximity to the main arm chip. What’s different is that it is simultaneously addressable by cpu and gpu cores, not part of the same die as the apple silicon unit.
The ram is soldered onto the SoC in close proximity to the main arm chip. What’s different is that it is simultaneously addressable by cpu and gpu cores, not part of the same die as the apple silicon unit.