I had heard similar cautions about ultrasonic cleaning with certain MEMS sensors, but I didn't realize the same concern could apply to exposed-die CMOS sensors as well.
Is the main risk the resonance frequencies of the bond wires, or more about mechanical stress propagating through the package?
I had heard similar cautions about ultrasonic cleaning with certain MEMS sensors, but I didn't realize the same concern could apply to exposed-die CMOS sensors as well.
Is the main risk the resonance frequencies of the bond wires, or more about mechanical stress propagating through the package?