I've always been cautioned against ultrasonic cleaning of boards that have crystal oscillators, and indeed it's in most XO datasheets.
I've also heard that one shouldn't trim the leads of a through-hole XO before soldering it into the board, since the mechanical shock of the lead breaking can ring the whole package and similarly shake it apart. I'm curious if anyone here has seen that in practice!
I've also heard that one shouldn't trim the leads of a through-hole XO before soldering it into the board, since the mechanical shock of the lead breaking can ring the whole package and similarly shake it apart. I'm curious if anyone here has seen that in practice!