I have always wondered how this works (along with wire bonding), especially in an economic way.
Chips being cheap makes sense at the lithography / wafer level because sure, you can stamp out thousands of them at once. But once you need to dice them up, bond wires to them, and package them... how on earth do you do that so efficiently that each chip can be sold for fractions of a cent?
Chips being cheap makes sense at the lithography / wafer level because sure, you can stamp out thousands of them at once. But once you need to dice them up, bond wires to them, and package them... how on earth do you do that so efficiently that each chip can be sold for fractions of a cent?