Comment by pzmarzly

Ever since mold relicensed from AGPL to MIT (as part of mold 2.0 release), the worldwide need for making another fast linker has been greatly reduced, so I wasn't expecting a project like this to appear. And definitely wasn't expecting it to already be 2x faster than mold in some cases. Will keep an eye on this project to see how it evolves, best of luck to the author.