> i will simply be able to recreate the baseboard with the new 4G module, a microcontroller, and some audio processing and power management circuitry and it will be able to seamlessly fit inside the phone.
Seems like a bigger project than the author would let us think ! But I hope to see the PCB soon !
I like the word "simply" in this sentence
> i will simply be able to recreate the baseboard with the new 4G module, a microcontroller, and some audio processing and power management circuitry and it will be able to seamlessly fit inside the phone.
Seems like a bigger project than the author would let us think ! But I hope to see the PCB soon !