A nice video, though it missed one of the most interesting aspects of BGA packages: their ability to self-centre during soldering. If the misalignment is less extreme than in the video, surface tension will pull the BGA package into alignment. Here is an example
Notice how in the second part of the video, once the solder has melted, the body of the BGA moves so it is correctly centred over the PCB pads. This is happening by itself, without an external influence pushing the chip into position.
https://www.youtube.com/watch?v=dz7ltWBDm7U
Notice how in the second part of the video, once the solder has melted, the body of the BGA moves so it is correctly centred over the PCB pads. This is happening by itself, without an external influence pushing the chip into position.