This is one of the benefits of the ECAM process happening completely at room temperature. Since the metal is deposited directly out of a liquid metal feedstock there's no thermal processing (sintering, melting, etc) which have traditionally caused shrinkage/warpage and porosity issues in other metal AM technologies.
Since the ECAM process has control over the deposit at the atomic scale, an extremely high level of purity is achieved. This is very important for high performance applications requiring thermal or electrical conductivity for instance.
Since the ECAM process has control over the deposit at the atomic scale, an extremely high level of purity is achieved. This is very important for high performance applications requiring thermal or electrical conductivity for instance.