Intel has a 1.4nm process in the pipeline for ~2027. They just took delivery on their first high NA EUV machine in order to start working on it.
Their gamble however is that they need to figure out DSA, a long storied technology that uses self-forming polymers to allow less light to sharply etch smaller features.
If they figure out DSA, they will likely be ahead of TSMC. If not, it will just be more very expensive languishing.
Their gamble however is that they need to figure out DSA, a long storied technology that uses self-forming polymers to allow less light to sharply etch smaller features.
If they figure out DSA, they will likely be ahead of TSMC. If not, it will just be more very expensive languishing.