Does someone with more knowledge know why this is not used more for chip production? Is it just new, and TSMC is screwed? What are the downsides? Speed?
Edit - thanks for the answers - and yes it would make more sense for ASML to be worried, and TSMC to be happy to not have to use/power/maintain machine that shoot nano-drops of tin with lasers: https://www.trumpf.com/en_US/solutions/applications/euv-lith...
Edit - thanks for the answers - and yes it would make more sense for ASML to be worried, and TSMC to be happy to not have to use/power/maintain machine that shoot nano-drops of tin with lasers: https://www.trumpf.com/en_US/solutions/applications/euv-lith...