Cooler chips. Chips heat due to resistance, and superconductors have zero resistance (by definition). I suspect this is the company's intended application. The following quote from their patent is very suggestive if you know about semiconductor manufacturing.
> In addition, various energy sources used for deposition are not limited to chemical vapor deposition (CVD) using heat, but atomic layer deposition (ALD), sputtering, and thermal evaporation, e-beam evaporation, molecular beam epitaxy (MBE), pulsed laser deposition (PLD), etc. are also included without limitation as long as the raw material can be deposited.
Listed methods are those used in semiconductor manufacturing to introduce materials to the wafers. It is also significant that the company's marketing material describes its resistance as "1/10^4 less than copper", because copper is currently used as a conductor in chips. (It wasn't always so, it used to be aluminium, which is a fascinating story itself. Read more on https://en.wikipedia.org/wiki/Copper_interconnects.)
https://patents.google.com/patent/WO2023027537/en
> In addition, various energy sources used for deposition are not limited to chemical vapor deposition (CVD) using heat, but atomic layer deposition (ALD), sputtering, and thermal evaporation, e-beam evaporation, molecular beam epitaxy (MBE), pulsed laser deposition (PLD), etc. are also included without limitation as long as the raw material can be deposited.
Listed methods are those used in semiconductor manufacturing to introduce materials to the wafers. It is also significant that the company's marketing material describes its resistance as "1/10^4 less than copper", because copper is currently used as a conductor in chips. (It wasn't always so, it used to be aluminium, which is a fascinating story itself. Read more on https://en.wikipedia.org/wiki/Copper_interconnects.)
https://patents.google.com/patent/WO2023027537/en