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Comment by Aromasin

What on earth are you talking about? The article is discussing partnering with Arm using their 18A node. At 20A, Intel will be transitioning from its FinFET design over to a new type of transistor, known as a Gate-All-Around transistor, or GAAFET. In Intel’s case, the marketing name they are giving their version is RibbonFET. This is a technology that only started to come to a head in early 2020. The other arm of Intel’s 20A and onwards design is what the company is calling ‘PowerVia’. This is usually referred to as ‘backside power delivery’ in the industry. Although slightly older, we're still only talking about 2017 at the earliest.

Intel has its 2nm node (called 20A, followed by 18A six months later) lined up for production to start in the first half of 2024, which compares to TSMC’s equivalent node (called N2) which is scheduled for the second half of 2025. 18A will be half a node denser than N2, while also being 12 months earlier to market.

As to IFS as a concept, it's only recently been revamped in 2021 after a lackluster attempt in 2013 as you mentioned. So far they've announced partnerships with Arm, MediaTek, Qualcomm, AWS, and the DoD. That's a pretty heavy hitting pack, not including all of Tower Semiconductors customers. Intel wouldn't be building another 3 fabs if it wasn't serious this time about building capacity for other companies.

parent Aromasin 3 years ago

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