AMD has done extremely well with multi-chip(let) modules. Zen cores & zen clusters (on Core Chiplet Die, CCD) are wonderfully small, and a huge amount of the regular stuff cores do is relegated to the IO Die (CCX), which is not as cutting edge.
But wow there's a bunch of power burned on interconnect between CCDs and CCX. And now AMD's new southbridge, Promontory 21, made by Asmedia, is another pretty significant power hog, and the flagship X670 tier is powered by two of these.
There's absolutely a challenge to bring power down. I'm incredibly super impressed by AMD's showing, & they've done very well. But they've been making trade-offs that have pretty large net impacts, especially if we measure at idle power.
But wow there's a bunch of power burned on interconnect between CCDs and CCX. And now AMD's new southbridge, Promontory 21, made by Asmedia, is another pretty significant power hog, and the flagship X670 tier is powered by two of these.
There's absolutely a challenge to bring power down. I'm incredibly super impressed by AMD's showing, & they've done very well. But they've been making trade-offs that have pretty large net impacts, especially if we measure at idle power.