> the spaces between slender ruthenium lines can easily be filled with air, which is the best insulator available.
This surprised me. With the extremes that chip manufacturers already go to, I would have thought that filling the chip with a vacuum would be relatively straightforward. I thought that a vacuum would be an even better insulator?
Happy to be told why I'm wrong here, perhaps the benefits are not as great as I think or maybe it is not possible to maintain the vacuum over the expected lifetime of the chip?
This surprised me. With the extremes that chip manufacturers already go to, I would have thought that filling the chip with a vacuum would be relatively straightforward. I thought that a vacuum would be an even better insulator?
Happy to be told why I'm wrong here, perhaps the benefits are not as great as I think or maybe it is not possible to maintain the vacuum over the expected lifetime of the chip?