> It also means TSMC’s 3 nm process isn’t ready, probably not shipping until late 2022. Apple, by virtue of their tight partnership with TSMC has known about and taken precautions against the 3 nm schedule, hence the initially undisclosed M1 Max UltraFusion design wrinkle, likely an early 2021 decision.
I find it hard to believe that this was a last-minute decision. Rather, I think this pattern of a new core design (using a new process if there is one) releases first for the smallest devices (iPhones), and the gradually moves its way up the lineup all the way up the Ultra before the cycle repeats with a new generation is likely Apple's new strategy going forwards.
My understanding is that this is pretty much what Intel and AMD do too (releasing their smaller dies on new processes first) and that this is a general strategy for dealing with poorer yield number on new process nodes. The idea that Apple would ever have considered releasing their biggest chip as the first chip on a new node seems far-fetched to me.
I find it hard to believe that this was a last-minute decision. Rather, I think this pattern of a new core design (using a new process if there is one) releases first for the smallest devices (iPhones), and the gradually moves its way up the lineup all the way up the Ultra before the cycle repeats with a new generation is likely Apple's new strategy going forwards.
My understanding is that this is pretty much what Intel and AMD do too (releasing their smaller dies on new processes first) and that this is a general strategy for dealing with poorer yield number on new process nodes. The idea that Apple would ever have considered releasing their biggest chip as the first chip on a new node seems far-fetched to me.