Most semiconductor production processes like etching, doping, polish etc are done on the full wafer, not on individual images/fields. So there is nothing to be gained there in terms of production efficiency.
The litho step could in theory be optimized by skipping incomplete fields at the edges, but the reduction in exposure time would be relatively small, especially for smaller designs that fit multiple chips within a single image field. I imagine it would als introduce yield risk because of things like uneven wafer stress & temperature, higher variability in stage move time when stepping edge fields vs center fields, etc.
The litho step could in theory be optimized by skipping incomplete fields at the edges, but the reduction in exposure time would be relatively small, especially for smaller designs that fit multiple chips within a single image field. I imagine it would als introduce yield risk because of things like uneven wafer stress & temperature, higher variability in stage move time when stepping edge fields vs center fields, etc.