this is close to subtractive PCB manufacturing,
the palladium is 'soaked' onto the FR4 substrate
then build up with electroless copper.
seems the only difference is the filament has the
required trace of paladium embedded in the filament.
certainly easy way to make pcb's by direct write to
substrate and then additive plating up.
I didn't say it's better, but might have quick turn use.
certainly easy way to make pcb's by direct write to substrate and then additive plating up.
I didn't say it's better, but might have quick turn use.