Comment by zozbot234

I assume that multi-chip packages will soon develop as a new source of modularity within chip fabrication itself. There will be common standards for how multiple chiplets can be wired inside of a package, and the OEM will no longer be restricted to having a single supplier like TSMC for the entire "package" component but be free to choose among multiple, freely-competing suppliers ala TSMC, Intel, Samsung, SMIC etc. Then the "geopolitical" need for an advanced, billion-dollar "fab" will essentially be disintermediated away - only a few tiny, perhaps optional components will ever be manufactured at anything like a 7nm or 5nm process. Everything else will simply end up as a basic commodity.