We were talking just the other day about back-side power distribution in ICs. Basically you bury the power rails really deep, lap the chip down to half a micrometer, and add through vias to ge to the rails.
So now you’ve got a very thin chip and all the power comes in on the side with pretty much nothing else on it. I wonder if you mount the chip backside up, put these little peltier devices on the hot spots, if you can maintain a higher heat transfer rate.
So now you’ve got a very thin chip and all the power comes in on the side with pretty much nothing else on it. I wonder if you mount the chip backside up, put these little peltier devices on the hot spots, if you can maintain a higher heat transfer rate.