If I'm understanding you right, what you're suggesting is that the individual silicon modules will be fixed, but they will be contected in a single package in lot's of different ways.
If that's correct I'd love to see the cost of making the trip between the modules. I've got to imagine the cost of that is just huge. The interconnect is also crazy - it's easy to do complex routing tasks on silicon at high performance. I don't know how you acheive that in a scalable fashion between silicon.
If that's correct I'd love to see the cost of making the trip between the modules. I've got to imagine the cost of that is just huge. The interconnect is also crazy - it's easy to do complex routing tasks on silicon at high performance. I don't know how you acheive that in a scalable fashion between silicon.