>It is also surprising to me to see how far Intel has fallen from the process lead they had. First with HKMG by several years, first with FinFet by several year, I suppose they are still first to do cobalt interconnect but in terms of process density the foundries have caught them and appear poised to take a substantial lead over the next several years.
>With Intel offering foundry processes and GF, Samung and TSMC all offering leading edge processes the industry now has four viable leading edge process options.
>With Intel offering foundry processes and GF, Samung and TSMC all offering leading edge processes the industry now has four viable leading edge process options.
Exciting times.