I am assuming that having RAM and CPU (and other functions such as GPU or other hardware accelerators) on same die on different levels (physically close ie nano or micrometers apart) would cut latency by orders of magnitude.
3D is already done with NAND flash so I am assuming it is heat that is the problem.
I am assuming that having RAM and CPU (and other functions such as GPU or other hardware accelerators) on same die on different levels (physically close ie nano or micrometers apart) would cut latency by orders of magnitude.
3D is already done with NAND flash so I am assuming it is heat that is the problem.
Just my 10c