So, what's involved in packaging them? I'm thinking along the lines of me coming up with a custom circuit that I print onto silicon, package into a chip, and put that sucker on a PCB. I figured the packaging would take similarly, specialized equipment given it's so tiny. Is it built into FIB equipment? Extra? How easy is it to use?
I always see articles on the ebeams and FIB showing how they work. Nothing on packaging.
I always see articles on the ebeams and FIB showing how they work. Nothing on packaging.