Re do better. I've skimmed enough papers on the stuff to say the physics is too complex for me to have an opinion either way. It's the implementation issues they're always fighting, though.
Re masks. I know. The reason I mention it is they're both essentually drawn by hand a piece at a time. Showing why one is too slow to use for significant volumes should enlighten you on other. Yet, if tiny volumes, might be acceptable but machines cost $$$.
Re eASIC. eASIC uses a multiple, eBeam machine for theirs. They might have more than one. They directly write the stuff onto the naterial. That it's a S-ASIC defined by one, custom layer is why it's so quick and cheap. A full ASIC has many layers so price/time goes way up.
Btw, I'd be interested in an email from the guy to ask him a few questions. Im especially interested if he needs a cleanroom, how he packages them, and what software is like to assess subversion counters at interface level.
Re masks. I know. The reason I mention it is they're both essentually drawn by hand a piece at a time. Showing why one is too slow to use for significant volumes should enlighten you on other. Yet, if tiny volumes, might be acceptable but machines cost $$$.
Re eASIC. eASIC uses a multiple, eBeam machine for theirs. They might have more than one. They directly write the stuff onto the naterial. That it's a S-ASIC defined by one, custom layer is why it's so quick and cheap. A full ASIC has many layers so price/time goes way up.
Btw, I'd be interested in an email from the guy to ask him a few questions. Im especially interested if he needs a cleanroom, how he packages them, and what software is like to assess subversion counters at interface level.